For example, VCC3.3 copper pour 0.5mm, VCC1.8 copper pour pitch 0.6mm, other copper pour 0.4mm priority 16mil is the lowest pour a piece of copper to the VCC3.3 network and name the copper pour VCC3.3-ALL Pour a piece of copper to the VCC1.8 network and name the copper-clad VCC1.8-ALL the spacing rules must also be built, see the following pictures 3-6: If you want other copper-clad spacing, you need to create a new copper-clad rule. The following 2 figure shows the viaconnect with copper-clad full-connected vias, the default safety clearance is 8mil, and the copper-clad spacing is 16mil regular copper-clad. The spacing, such as routing to routing, and routing to pad vias, is a rule of 10mil, as shown in the following figure: These two spacing rules together constitute a copper-clad spacing of 20mil. The level Poly is higher than the default Clearance of 10mil.
#INSERT FULL CONNECTED VIAS IN ALTIUM DESIGNER 16 FULL#
Under Design>Rules>Electrical>Clearance in the PCB design environment, right-click to create a new spacing rule and rename it to Poly, select Advanced (Query) for Where The First Object Matches, enter polygon for Full Query and change the default 10mil to 20mil for Constraints. If you want advanced rules, you must create new ones yourself. The distance between VCC3.3 and VCC1.8 is 0.5mm.Īltium Designer's spacing rules default to a 10mil spacing, and there is no distinction between pads to pads, vias to vias, and traces to copper. This article is going to tell you about the PCB Advanced Spacing Rules on Altium designer.įor example, the copper pour pitch is 16mil, other safety pitches are 8mil, the via-to-via pitch is 100mil, the pad-to-pad pitch is 100mil, the pad-to-via pitch is 100mil, the top ground copper is 0.8mm, the top layer PCB Advanced Spacing Rules- Altium Designer's spacing rules